Inside the electronics operation
How an idea becomes a solution you can trust.
Manufacturing process
- NXT III Fuji placement line — lead-free and lead-based, capacity available
- 100% 3D laser solder paste inspection before placement
- Automated optical inspection of placed components
- Hand-placed through-hole with selective solder
- Conformal coat and encapsulated (potted) module assembly
- Screw and crimp housing capabilities
Electronic test
- In-circuit test (ICT) for board-level fault coverage
- Functional test at board and module level
- Parametric test and tester development built in-house
- End-of-line functional test designed alongside the product
- Thermal characterisation under load
- EMC / EMI evaluation through design and layout review
Quality processes
- APQP product development and industrialization
- DFMEA, PFMEA and worst-case calculation before build
- Electrical, mechanical and manufacturability design reviews
- Component traceability — lot and date code to product serial number
- Scorecard and key metric review
- Timely internal audits under the Soaris Management System
